The PRO X670-P WIFI motherboard supports AMD Ryzen 7000 series processors.

Form Factor: ATX

Socket Type: AM5

Chipset: AMD X670

With its dual 8-pin power connectors and exclusive Core Boost technology, the PRO X670-P WIFI is able to sustain heavy CPU power loads to support system-demanding settings:

1. Digital PWM IC

2. 14 Duet Rail Power System with 80A SPS

3. 2-Phase SOC Power

4. 1-Phase MSIC Power

VRM Cooling: Features an Extended Heatsink design and 7W/mK MOSFET thermal pads for improved thermal dissipation.

PCB Cooling: An 8-layer server-grade printed circuit design with 2 oz. thickened copper improves heat dissipation & performance.

SSD Cooling: Double-sided M.2 Shield Frozr prevents thermal throttling.

System Cooling: Connect and synchronize cooling with strategically placed pin-headers - including a dedicated pump-fan header.

The PRO X670-P WIFI motherboard features MSI's latest M.2 slots:

1 x Gen5 x4 128Gb/s slot

3 x Gen4 x4 64Gb/s slots

MSI PCI Express Steel Armor slots are secured to the motherboard with extra solder points to support the weight of heavy graphics cards. When every advantage in games counts, Steel Armor also shields the point of contact from electromagnetic interference:

3 x PCI-e 4.0 x16 slots* (PCI_E1 & PCI_E3 with Steel Armor)

1 x PCI-e 3.0 x1 slot

*Supports x16/x4/x2

Even the world’s fastest SSDs will automatically slow if thermal throttling firmware detects excessively high temperatures.

Double-sided M.2 Shield Frozr: MSI's most advanced thermal solution, offering the best possible protection to ensure maximum SSD transfer speed performance.

Memory Boost: A fully-isolated DDR circuit delivers pure data signals for optimal gaming and overclocking performance.

Memory OC profiles in MSI BIOS are MSI OC LAB checked and can be easily enabled with auto power settings for optimized memory speed and stability.

*1DPC 1R Max. overclocking frequency 6000 MHz, supports AMD EXPO.

2.5G LAN: A 2.5Gbps LAN controller delivers a premium network gaming experience.

Wi-Fi 6E: Features the latest Wi-Fi 6E module (ultra-low latency, high-bandwidth) & Bluetooth 5.2 technology.

USB 3.2 Gen 2x2 Type-C: Connect to devices and transfer files at high bandwidth rates: 20Gb/s.

HD Audio: 7.1-Channel High Definition Audio with Audio Boost 5 & S/PDIF output.